Enabling interoperability in high-performance embedded applications

OpenVPX expands on the VPX Base and Dot Specifications and provides a System Specification to address interoperability issues between VPX modules and Chassis. OpenVPX is an extensible specification which addresses the current and future needs for computing in harsh environments.

Risk management for counterfeit materials

Counterfeit materials will continue to challenge the defensive capabilities of manufacturers in the military and aerospace industry.

Overview about the 6U VPX single board computer VPX6-185

This Video is presented by Curtiss-Wright Controls Embedded Computing Curtiss-Wright Controls Embedded Computing’s VPX6-185 6U VPX single board computer is a high performance rugged processing platform.


Early verification and validation using model-based design

One of the primary benefits of model-based design is the opportunity to do rigorous verification and validation in parallel with all other development steps, especially early in the development process.

Smarter products - software becomes the most active ingredient

As software becomes the most active ingredient in product innovation, traditional manufacturers are essentially becoming software companies. While this transformation is sparking unprecedented leaps in product value, it is also introducing new challenges and implications.

Building ultra-slim embedded systems with Em-ITX

Building a slimline or thinline embedded system can be a difficult task or a relatively simple one depending on the form factor chosen for the task. But how slim is slim enough?

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Embedded News & Know-how Newsletter

(Feb 3, 2010)
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VIA: 6 x 6 cm COM based on Mobile-ITX form factor

VIA Technologies announces the VIA EPIA-T700 based on the Mobile-ITX form factor. Measuring a mere 6 x 6cm, the EPIA-T700 is a compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications. With customized carrier boards connected using ultra low profile 3mm connectors, the VIA EPIA-T700 is in a class of its own.

The EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer industry-leading I/O flexibility in the most compact of available form factors. The EPIA-T700 features 512MB of DDR2 on-board system memory.

The VIA VX820 media system processor adds a key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.

An integrated multi-configuration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA. The EPIA-T700 uses two high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.